Search results for "Electromagnetic Impedance"
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On the use of the EMI for the health monitoring of bonded elements
2014
The low weight, robustness and fatigue resistance of adhesive joints make them suitable for structural joints. A fully developed nondestructive evaluation technique however is needed to monitor and assess the quality of bonded joints. In the present paper the application of the electromechanical impedance (EMI) technique is proposed. In the EMI method a piezoelectric transducer (PZT) is attached to the structure of interest. The high sensitivity and low power consumption make the EMI method feasible for real time structural health monitoring. In this study we investigated the sensitivity of the electromechanical response of a PZT to the curing and the quality of the adhesive used for bonded…